|
|
Thermally
Advantaged Chassis |
|
|
Control
panel on the top of front panel for reaching it easy |
|
|
Screw-less
CDROM, HDD & Add-on cards assembly |
|
|
Screw-less
lockable side panel |
|
|
CAG1.1
for thermal solution |
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|
U-Seam
designed for EMI solution |
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|
High
performance for AGP card holder |
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|
Front
access USB2.0+Audio+IEEE1394 |
|
|
Low
acoustic level |