|
|
Thermally
Advantaged Chassis |
|
|
Front
access USB2.0+Audio+IEEE1394 (Optional) |
|
|
CAG1.1
for thermal solution (Optional) |
|
|
Easy
for system assembly and time saving |
|
|
Low
acoustic level |
|
|
Snap-in
front panel, screw-less and wire-free |
|
|
Excellent
ventilation & EMI containment |
|
|
Side
opening cover, easy for system maintenance |
|
|
Reusable
metal cover with excellent EMI shielding for all exposed
drive bays,
allows systems' re-structuring |
|
|
Built-in
standoffs, saving assembly time |
|
|
Intel®
Desktop Boards D845GERG2 Tested Chassis List --- 35xx
|
|
|
Intel®
Desktop Boards D845GVAD2 Tested Chassis List --- 35xx
|
