Thermally Advantaged Chassis
Low acoustic level
Snap-in front panel, screw-less and wire-free
Excellent ventilation & EMI containment
Front access USB2.0 & Audio, IEEE1394 optional
Optional Air Guide for Thermal Solution
Easy for system assembly and time saving
Side opening cover, easy for system maintenance
Reusable metal cover with excellent EMI shielding for all exposed drive bays, allows systems' re-structuring
Built-in standoffs, saving assembly time
Test Report :
  EMI Test Report
  Thermal Test Report
35xx Thermally Advantaged Chassis
PASS Intel® Pentium®4 Processor on 90 nm process in the 775-land package with PRB = 1 Chassis Thermal / Mechanical Compliance test

:: Optional For 35xx Series ::
-------------------------------------------------------------------------------------------------------------

SPECIFICATIONS
Model
YY-3509
Case dimension
180mm W x 405mm D x 360mm H
( 7.1"W x 15.9"D x 14.2"H )
Motherboard configuration Micro ATX
Drive configuration
Up to 5 drive bays :
2 - 5.25" exposed
1 - 3.5" exposed
2 - 3.5" hidden
Expansion slots and ports 4 slots
Front panel control Power switch, Reset switch, Power LED, HDD LED
USB/Audio/IEEE1394 (Optional)
Materials Metal: Recyclable SECC metal
Plastic: Flame retardant, UL approved
Meets the requirements of RoHs & WEEE
Emissions Designed to meet FCC class B-47 CFR part15/IEC/CISPR 22:1993
Net Weight 5.5kgs / 12.1lbs without PSU
6.5kgs / 14.3lbs with PSU
Color Cool Gray, Black
Power Supply ATX 12V 300W~450W
Options
1 x 8cm fan for rear-mounted
USB/Audio/IEEE1394 module
Air guide solution
Packing /Shipping
1.74cuft/each carion
576pcs/20'container
1192pcs/40' container
1315pcs/40HQ container

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